Toshiba announced the launch of 32GB embedded NAND flash memory modules that the company claims are the largest density yet announced, with the modules also having full compliance with the e-MMC and eSD standards. Samples will be available in September 2008, and mass production will start in the fourth quarter.
The new 32GB embedded devices combine eight 32Gbit NAND chips fabricated with Toshiba's 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA version 4.3 and SDA version 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association (MMCA) and SD Card Association (SDA), respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.